Australian Trademark Classification
semiconductor chips integrated with metalized ceramic substrate for heat dissipation purposes 97623
为散热目的，将半导体芯片与金属化陶瓷基板集成在一起
Chinese
为散热目的，将半导体芯片与金属化陶瓷基板集成在一起
English
semiconductor chips integrated with metalized ceramic substrate for heat dissipation purposes
Spanish
chips semiconductores integrados con sustrato cerámico metalizado para fines de disipación de calor.
- Site ref.
- 97623
- Class
- 09